Certifications Equipotential bonding

In some installations the wire tray needs to be equipotentially bonded. This is to secure protective bonding or functional bonding.

This is done to minimise the impact of electrical and magnetic fields (EMC). It is carried out in the same way as with protective bonding, i.e. by connecting the wire tray to the main earth terminal in the building.

The IEC 61537 standard lays down the requirements placed on a wire tray to ensure electrical continuity. Among other things, the impedance must not exceed 50 mOhm over joints or 5 mOhm X number of meters of wire tray.  X-Tray has been tested and complies fully with IEC 61537. The tests were conducted by the Research Institute of Sweden (SP) with test report numbers PX16030 and 5F015879.

The main reason for protection bonding is to protect against electrical shock that could be caused by faults in the electrical system. This is remedied by connecting the wire tray to the main earth terminal in the building.